Item |
Capability |
Board |
Layer |
1-6 layer |
Maximum Board Size |
Width：250/500 mm
Length：200-620 mm
(customer-oriented) |
Maximum Finished Dimension |
250*620 mm (Customer-oriented) |
Minimum Finished Dimension |
8mm*12mm (Customer-oriented) |
Maximum Material Thickness
(Double side with Copper) |
0.13 mm |
Minimum Material Thickness
(Single side with Copper) |
0.045 mm |
Auxiliary Materials |
Adhesive Thickness |
pressure-sensitive adhesive ：50 μm |
Thermosetting Adhesive |
12.5/15/25 μm |
PI Material Thickness |
5.0mil-11.0 mil |
PET |
white：0.05-0.25 μm |
transparent：0.025-0.25 μm |
FR-4 |
FR-4：>100μm (customer-oriented) |
Other Materials |
Stainless steel、Aluminum Board and etc. (customer-oriented) |
Common Board |
Single side with adhesive
Double side with adhesive
Single side without adhesive
Double side without adhesive |
Electrolysis & Rolling
Adhesive：
PI 13μm / AD 13μm / Cu 12μm
PI 13μm / AD 13μm / Cu 25μm
PI 25μm / AD 20μm / Cu 35μm
Adhesiveless：
PI 13μm / Cu 12μm
PI 13μm / Cu 18μm
PI 25μm / Cu 35μm |
Item |
Capability |
Drilling Hole Tolerance |
Tolerance of Location |
First Drill:±0.05mm |
Second Drill:±0.1mm |
NC Hole Drilling |
Ф 0.15mm - Ф 6.5mm |
Minimum Drilling Hole |
Ф 0.60mm |
Aperture Tolerance (PTH) |
± 0.05mm |
Diameter Tolerance for
Drilling Holes |
± 0.025mm |
Minimum Film
Width/Space |
1/3oz Copper Minimum Width/Space |
0.1 mm |
1/2oz Copper Minimum Width/Space |
0.15 mm |
1oz Copper Minimum Width/Space |
0.2 mm |
Etching Compensation：1 oz |
0.03 - 0.04 mm
Minimum Line Width 0.07mm |
Etching Compensation：1/2 oz |
0.02 - 0.03mm
Minimum Line Width 0.06mm |
Etching Compensation：1/3oz |
0.01 - 0.02mm
Minimum Line Width 0.055mm |
Etching Tolerance |
0.02 |
Dry-Film |
Alignment tolerance |
±0.05mm |
Tolerance of Location |
±0.075mm |
Minimum Grid |
0.13mm*0.25mm |
Item |
Capability |
Cover Layer Processing |
覆蓋膜最小方形開窗 |
0.6*0.6mm(Steel Mold Processing) |
Minimum Space
between Holes on Coverlay |
0.5mm (Steel Mold Processing) |
0.1mm (Drill) |
Minimum Punching in Layer |
0.8mm(Steel Mold Processing) |
Hole to Pad Minimum Distance |
0.2mm |
Hole to Circuit Minimum Distance |
0.2mm |
Coverlay Resin Flow |
≤0.15 (single side) |
Solder Mask |
Hole to Pad Minimum Distance
(Single side) |
Single side 0.1 mm |
Green Ink |
0.1 mm |
Ink Thickness |
≥ 8μm |
Green Ink Minimum Height / Width |
1.0mm/0.15mm |
Character |
Regular Script Minimum Width |
0.25 mm |
Minimum Line Width |
0.15 mm |
Character Height |
0.7 mm |
Character to Pad Minimum Width |
安全值≥0.2mm |
Minimum Character Width |
0.4 mm |
Print Maximum Length |
515 mm |
Solder Mask Minimum Hole |
2.0mm * 2.2mm |
Circuit |
Minimum Line width |
0.35 mm |
Item |
Capability |
Surface Processing |
Immersion Nickel Thickness |
60-200u＂ |
Immersion Gold Thickness |
1-3u＂ |
Nickel plating Thickness |
60-200u＂ |
Gold plating Thickness |
1-20u＂ |
外型沖切 |
Size Tolerance |
±0.05mm(精膜製作) |
±0.10mm(普通鋼模) |
≥±0.20mm(Knife Mold) |
Minimum Width between Circuits |
≥0.5mm |
Half Hole Minimum Diameter |
0.25mm |
Circuit to outline Minimum Distance |
0.4mm(手割) |
0.2mm(Knife Mold) |
0.15mm(Steel Mold) |
0.1mm(精密模) |
Minimum Width of Square Punch |
0.6mm×0.8mm |
Drilling hole in Punching |
0.75mm |
Productive Equipment 
